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This video discusses the design of the AMD Ryzen 9 7950X CPU and how to delid it. The CPU is smaller and lighter than an Intel CPU due to the use of land grid array (LGA) sockets and the removal of pins from the motherboard. The video shows how to delid the CPU and describes the gold plating on the inner and outer layers of the chiplet die, the IHS, and the Center Patch. The adhesive is silicone, which is necessary to remove but also reduces performance.
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